BYK-P 9065

BYK P 9065 is a processing additive with mold release properties for low-shrink SMC and BMC. It completely replaces zinc stearate that is usually used as a mold release agent, simplifying raw material handling. Separation of the LS-SMC/BMC compounds is avoided and thus cobwebbing is reduced. Scrap rate is lowered due to reduced shrinkage and less warping. This is supported by higher gloss, lower haze, improved color homogeneity and a generally higher surface appearance of the finished parts. If the finished parts are to be painted or bonded, no sanding is required, as BYK P 9065 is firmly anchored in the cured resin and does not migrate to the surface. Due to the low dosage of the additive, it is virtually cost neutral. BYK P 9065 is recommended only for LS compounds. It provides benefits like simplified handling, reduced separation, lower scrap rates, improved appearance and finish for advanced material applications without requiring post-processing like sanding.